Google’s Plan for Custom In-House Chip: Redefining the Future of Pixel Devices

In the ever-evolving landscape of technology, Google has consistently aimed to push boundaries and revolutionize the user experience. One significant aspect of this endeavor is the development of its own custom in-house chip. Originally slated for release in 2024, the chip, codenamed “Redondo,” has been delayed until 2025 due to production challenges and internal coordination issues. This article explores Google’s strategic shift, its partnership with TSMC, and the implications for future Pixel devices.

Google’s Pursuit of Custom In-House Chip

Google, renowned for its software expertise, has recognized the need to optimize hardware capabilities to deliver the best user experience. With this goal in mind, the company ventured into developing its own custom in-house chip, set to redefine the performance and capabilities of its Pixel devices. The original plan was to release the highly anticipated “Redondo” chip in 2024, but unforeseen obstacles led to a rescheduling for 2025.

Delays and Challenges Faced by Google

Creating a custom chip is a complex process that requires extensive coordination and collaboration across multiple teams. Google encountered difficulties in engaging its employees and ensuring seamless development, leading to delays in the chip’s production timeline. Despite these setbacks, Google remains committed to delivering an exceptional product to its users.

Samsung’s Exynos to Google’s Tensor G5 Chip

Until the custom “Redondo” chip becomes available, Google will continue to rely on Samsung and its Exynos platform for the upcoming Pixel 9 series. However, the Pixel 10 series will mark the transition to Google’s fully custom Tensor G5 chip. This shift reflects Google’s aspiration for greater control over the hardware-software integration and overall device performance.

The Advantages of Google’s Custom Chip

With the gradual reduction of reliance on Samsung components, Google aims to incorporate more of its intellectual property into each generation of the Tensor chip. This strategic approach empowers Google to optimize performance, power efficiency, and overall user experience. The upcoming Tensor G5 chip, designed by Google and manufactured by TSMC, holds the promise of exceptional advancements.
Partnering with TSMC for manufacturing the Tensor G5 chip allows Google to leverage TSMC’s advanced 3nm process and Integrated Fan-Out technology. This synergy enhances power efficiency and reduces the thickness of the chip. By developing a fully custom chip and fine-tuning the hardware-software integration, Google can deliver superior performance, innovative features, and a seamless user experience.


Google’s decision to develop a fully custom chip and partner with TSMC signifies its commitment to redefining the future of Pixel devices. The shift from Samsung’s Exynos platform to Google’s Tensor G5 chip represents a pivotal moment in the evolution of Google’s hardware capabilities. With enhanced performance, power efficiency, and hardware-software integration, future Pixel devices and other Google products are poised to elevate the user experience to new heights.

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